Wafer cutting technology is of great significance in photovoltaic cell materials, and cutting technology has long been a research hotspot in the photovoltaic industry.
Silicon wafers are at the forefront of the manufacturing process in the photovoltaic industry chain. The function of the silicon wafer link is to process the silicon material into silicon wafers of standard size, which are applied to downstream cells and components, and play a role in the industry chain.
Silicon wafer cutting technology is mainly divided into inner circle cutting and wire cutting technology.
At present, the silicon wafer cutting technology mostly adopts wire cutting technology. Compared with the previous inner circle cutting, it has the advantages of high cutting efficiency, low cost and less material loss. Therefore, wire cutting technology is the mainstream of cutting technology in the future.
Among the wire cutting technology, the most prominent is the diamond wire loop cutting. Simply put, it is an extremely fast closed wire with sharp diamonds on the wire for cutting.
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