The cutting efficiency of the diamond wire can be divided into the following aspects compared with the cutting of
free silicon carbide.
The consolidation method, that is, the diamond cutting involved in grinding, also reduces the mutual wear
between the abrasives.
The hardness of diamond is high, and the wear resistance of diamond is strong, which will greatly extend the
service life of endless diamond wire.
The cutting line speed is high, the contact area between the diamond and the silicon wafer is increased, and the
diamond wire loop can withstand other defects caused by the high line speed, thereby exerting the advantage of
high cutting speed.
Contact: Ensoll Tools Technology CO.,LTD
Add: Liandong U Valley Enterprise Port,Building 1, 3rd Floor, Lotus Street, High-tech Zone, Zhengzhou,China