diamond wire cutting technology for photovoltaic crystal silicon wafer

With the continuous development of photovoltaic industry and the reduction of diamond wire price, the cutting field of photovoltaic crystal silicon wafer has become the largest application field of diamond wire, accounting for more than 90% of the diamond wire market.

Diamond wire is the abbreviation of diamond cutting line, also known as diamond cutting line or diamond wire. It is mainly used in the cutting field of hard and brittle materials such as photovoltaic silicon wafer, sapphire, magnetic materials, crystal materials and so on. The principle of diamond wire cutting is to evenly distribute the diamond micro particles on the high-strength steel line with a certain density and carry out high-speed grinding movement with the object to be cut, so as to achieve the purpose of cutting. Cutting with diamond wire can improve cutting speed, reduce material loss, improve product quality, and realize environmental protection production and manufacturing, but its cost is relatively high.

Ensoll tool have already obtained sufficient experience in cutting tire and Has been recognized by many tire manufacturers. This cutting does not underestimate the hardness and toughness of the steel wire in the tyres and always bring you smooth, plat, clear, burr-free, complete and non-destructive section/cutting surface.