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Silicon Cutting With Endless Diamond Wire

Silicon wafer is used as main substrate to build the vast majority of semiconductor devices for photovoltaic solar modules. One of the technologies used to cut silicon ingots into wafers is the multi-wire sawing with diamond coated wires. Although the wire sawing technology has been used in industry for decades, there is still a lack of scientific knowledge about it. If you have any requirements for monocrystalline or pollycrystalline silicon cutting, please contact us, Ensoll Loop diamond wire is the best solution for you!



    Contact: Ensoll Tools Technology CO.,LTD

    Phone: +86-18137168200

    Tel: +86-371-56622880

    Email: yuansu@yuansutools.com

    Add: Liandong U Valley Enterprise Port,Building 1, 3rd Floor, Lotus Street, High-tech Zone, Zhengzhou,China