The Mortar Cutting
1) The surface is rough, there is no sawing mark in the cutting direction of the silicon wafer.
2) The distance between the silicon carbide friction silicon wafer is short, and random bumps are generated.
The Diamond Wire Cutting
1) The surface is relatively smooth, and it can be seen that parallel grooves are generated due to the
friction of the diamond wire.
2) The groove has irregular grooves along the groove direction caused by irregular diamond friction.
Contact: Ensoll Tools Technology CO.,LTD
Add: Liandong U Valley Enterprise Port,Building 1, 3rd Floor, Lotus Street, High-tech Zone, Zhengzhou,China