The Diamond Wire Loop cutting Application for the Semi-Conductor

In the past, the cutting methods of the semi-conductor mainly have: Diamond circular saw cutting, diamond band saw cutting, free abrasive wire saw cutting, there have many defects of the old cutting methods, but the biggest defect is the low cutting efficiency.

Good cutting methods have a critical role in the efficiency and quality of semiconductor materials, diamond wire loops balances the 2 characters, such as for the 200mm diameters silicon ingot, the 0.65mm OD endless diamond wire could cut more than 200 times with good surface, greatly save the production cost.