Silicon Cropping with Diamond Wire Saw

Diamond Wire saw is a tool used to thinly slice rectangular silicon ingots that are pre-cut to the dimensions of each wafer.

When do the silicon wafer cutting, the diamond wire loops could be worked under high speed and the cutting not easy to produce the chatter, with better surface finish. For silicon cutting, the surface finish is among 0.328-0.6μm, the total thickness variation is about 10μm.
For Silicon bulk cutting, the endless diamond wire saws we are supplying is as follows (Other length on request):
0.65D*L2960mm Diamond wire loop
0.65D*L2670mm Diamond wire loop
0.65D*L2640mm Diamond wire loop
Ensoll offer a complete technical and long term support for the needs of our customers, including the personalized recommendations.

https://youtu.be/GONSTMYP8qA